Semiconductor wafer accommodating jig

ABSTRACT

A jig for accommodating and transferring a carrier for carrying at least an article, the carrier having a first container with a first opening larger than the article, and the carrier having at least a first flange structure which extends from a peripheral portion of the first opening, and the first flange structure having a first size defined to be a distance between opposite edges of the first flange structure in a first direction, wherein the jig comprises a second container having a second opening with a second size larger than the first size of the first flange structure of the carrier, and the jig further has at least a second flange structure in an opposite side to a side provided with the second opening, and the second flange structure has a third size larger than the second size, and the jig also has at least a window structure which extends at least opposite sides and which is positioned adjacent to the second flange structure, so that the window structure is closer to the second opening than the second flange structure, wherein the first opening of the carrier is sealable with a part of an inner wall of the second container as the jig by making the first opening of the carrier into contact with the part of the inner wall of the second container as the jig, and wherein the window structure comprises a flexible sheet deformable by an externally applied force.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor wafer accommodatingjig, a handling method and a production system

One of the serious issues in the processes for advanced semiconductordevices is that an adhesion of fine dusts on the semiconductor devicemight provide a fatal damage to the product, resulting in a drop of theyield, for which reason automation of the production line is made bytaking into account of separation of the line from dusts or any forgenerating dusts. Actually, however, it is difficult to realizeautomatic maintenance and automatic trouble shooting systems, even humanis the source for generating dusts.

To settle the above problems, it is effective to isolate thesemiconductor device from atmosphere. In view of this, it was proposedto accommodate a carrier for the semiconductor device into a tightlyshield box for realizing the automation. This is disclosed in Japaneselaid-open utility model publication No. 59-83038. This method, however,provides a problem with complicated operations of the box so that theyield is dropped. Further, a long time accommodation of the carrier forthe semiconductor wafer into the box causes another problem withgeneration of gas from the semiconductor wafer so that the box is filledwith the gas, whereby the characteristics of the semiconductor wafermight be changed.

In the above circumstances, it has been required to improve theproductivity of the semiconductor devices and to develop a highperformance dust removing apparatus for removal of dusts as many aspossible to reduce the probability of the adhesion of the dust on thesemiconductor wafer. Except when the maintenance and the troubleshooting are carried out by person along with exposure of thesemiconductor wafer to atmosphere including dusts, the semiconductorwafer is accommodated in a tightly shielding box for certain isolationof the semiconductor wafer from the atmosphere.

The descriptions will focus on a conventional method of transferring thecarrier for semiconductor wafer to another transfer table with referenceto FIGS. 1A and 1B. FIG. 1A is a view illustrative of a conventionalcarrier transfer system before transferring the carrier forsemiconductor wafers from a first transfer table to a second transfertable involved in a conventional transfer method. FIG. 1B is a viewillustrative of a conventional carrier transfer system after havingtransferred the carrier for semiconductor wafers from the first transfertable to the second transfer table involved in the conventional transfermethod A conventional carrier transfer system is to transfer a carrier40 for semiconductor wafers 60 from a first transfer table 61 to asecond transfer table 62. A box transfer device 63 is provided over thefirst transfer table 61. An opening and closing transfer system 64 isprovided over the second transfer table 62. The opening and closingtransfer system 64 has a carrier transfer device 66 positioned over thesecond transfer table 62 and an adsorber 65 positioned over the secondtransfer table 62. A box 50 is placed on the first transfer table 61. Acarrier 40 for mounting a plurality of semiconductor wafers 60 isaccommodated in the box 50. The carrier 40 has a carrier flange 41 forallowing the carrier transfer device 66 to catch the carrier flange 41.The box 50 comprises a box body 51 and a box cap 52 for sealing thecarrier 40 in the box from atmosphere The box 50 also has a box flange53 for allowing the box transfer device 63 to catch the box flange 53.The box cap 52 is removed from or capped onto the box body 51 by theadsorber 65.

For carrier unloading operation, the box transfer device 63 is operatedto move down to a lower level than the box flange 53 of the box 50 sothat the box transfer device 63 is closed to catch the box flange 53 forrifting the box 50 up from the first transfer table 61. The box transferdevice 63 is then moved toward the second transfer table 62, before thebox transfer device 63 is fallen so that the box 50 is placed onto thesecond transfer table 62. The box transfer device 63 is opened torelease the box 50. The box transfer device 63 is moved back to theoriginal position over the first transfer table 61. In place, theopening and closing transfer system 64 is operated to move to a positionover the box 50 placed on the second transfer table 62. The adsorber 65is made into adsorption with the box cap 52 before the adsorber 65 ismoved upwardly so as to rift the box cap 52 up from the box body 51,whereby the box cap 52 is opened. The carrier transfer device 66 isoperated to move down to a lower level than the carrier flange 41 of thecarrier 40 so that the carrier transfer device 66 is closed to catch thecarrier flange 41 for rifting the carrier 40 up from the box 50. Thecarrier transfer device 66 is then moved toward other position than thebox 50 but over the second transfer table 62, before the carriertransfer device 66 is fallen so that the carrier 40 is placed onto theother position than the box 50 but on the second transfer table 62. Thebox transfer device 63 over the original position over the firsttransfer table 61 is moved to a position over the second transfer table62. The carrier transfer device 66 is opened to release the carrier 40.The box transfer device 63 is operated to move down to a lower levelthan the box flange 53 of the box 50 on the second transfer table 62 andconcurrently the adsorber 65 with the box cap 52 is moved down onto thebox 50 so that the box cap 52 is placed on the box body 51 of the box 50before the adsorber 65 comes free of adsorption with the box cap 52 torelease the box cap 52 from the adsorber 65, whereby the box cap 52 iscapped on the box body 51 of the box 50. The adsorber 65 is movedupwardly to back to the original position over the second transfer table62. Also the carrier transfer device 66 is moved upwardly to back to theoriginal position over the second transfer table 62. Further, the boxtransfer device 63 is closed to catch the box flange 53 for rifting thebox 50 up from the second transfer table 62. The box transfer device 63is then moved from the second transfer table 62 toward the firsttransfer table 61, before the box transfer device 63 is fallen so thatthe box 50 is transferred back onto the first transfer table 61. The boxtransfer device 63 is opened to release the box 50 on the first transfertable 61. The box transfer device 63 is moved back to the originalposition over the first transfer table 61.

For carrier loading operation, the box transfer device 63 is operated tomove down to a lower level than the box flange 53 of the box 50 so thatthe box transfer device 63 is closed to catch the box flange 53 forrifting the box 50 up from the first transfer table 61. The box transferdevice 63 is then moved toward the second transfer table 62, before thebox transfer device 63 is fallen so that the box 50 is placed onto otherposition than the carrier 40 on the second transfer table 62. The boxtransfer device 63 is opened to release the box 50. The box transferdevice 63 is moved back to the original position over the first transfertable 61. In place, the opening and closing transfer system 64 isoperated to move to a position over the box 50 placed on the secondtransfer table 62. The adsorber 65 is made into adsorption with the boxcap 52 before the adsorber 65 is moved upwardly so as to rift the boxcap 52 up from the box body 51, whereby the box cap 52 is opened. Thecarrier transfer device 66 is operated to move down to a lower levelthan the carrier flange 41 of the carrier 40 so that the carriertransfer device 66 is closed to catch the carrier flange 41 for riftingthe carrier 40 up from the second transfer table 62. The carriertransfer device 66 is then moved toward a position over the box 50 onthe second transfer table 62, before the carrier transfer device 66 isfallen onto the box 50 on the second transfer table 62, so that thecarrier 40 is placed into the box body 51 of the box 50, whereby thecarrier 40 is accommodated within the box body 51. The adsorber 65 withthe box cap 52 is moved down onto the box 50 so that the box cap 52 isplaced on the box body 51 of the box 50 before the adsorber 65 comesfree of adsorption with the box cap 52 to release the box cap 52 fromthe adsorber 65, whereby the box cap 52 is capped on the box body 51 ofthe box 50. The adsorber 65 is moved upwardly to back to the originalposition over the second transfer table 62. Also the carrier transferdevice 66 is moved upwardly to back to the original position over thesecond transfer table 62. The box transfer device 63 over the originalposition over the first transfer table 61 is moved to a position overthe second transfer table 62. The box transfer device 63 is operated tomove down to a lower level than the box flange 53 of the box 50 on thesecond transfer table 62. Further, the box transfer device 63 is closedto catch the box flange 53 for rifting the box 50 up from the secondtransfer table 62. The box transfer device 63 is then moved from thesecond transfer table 62 toward the first transfer table 61, before thebox transfer device 63 is fallen so that the box 50 is moved onto thefirst transfer table 61. The box transfer device 63 is opened to releasethe box 50 on the first transfer table 61. The box transfer device 63 ismoved back to the original position over the first transfer table 61.

FIG. 2 is a schematic perspective view illustrative of a conventionalproduction line utilizing the above conventional carrier transfer systemof FIGS. 1A and 1B. The conventional production line has a plurality ofmanufacturing equipments 71, a plurality of automatic carrier trucks 73,and an automatic rack 72. Each of the automatic carrier trucks 73 has aloading surface 76 for carrying the box 50 accommodating the carrier 40for carrying a plurality of the semiconductor wafers 60. Each of themanufacturing equipments 71 has an entrance 74 which is provided withthe opening and closing transfer system 64. The automatic rack 72 alsohas an entrance 75 which is provided with the opening and closingtransfer system 64. Each of the automatic carrier trucks 73 has the boxtransfer device 63. The loading surface 76 of the automatic carriertruck 73 in FIG. 2 corresponds to the first transfer table 61 in FIGS.1A and 1B. The entrance 74 of the manufacturing equipment 71 and theentrance 75 of the automatic rack 72 in FIG. 2 correspond to the secondtransfer table 62 in FIGS. 1A and 1B. The carrier loading and unloadingoperations between the loading surface 76 of the automatic carrier truck73 and the entrances 74 and 75 are accomplished as described above withreference to FIGS. 1A and 1B.

The above conventional carrier transfer system has the following fourdisadvantages. The first disadvantage of the conventional carriertransfer system is that it takes a long time to carry the carrier andloading or unloading the carrier because it is necessary to open andclose the box cap of the box and carry the box free of the carrier.

The second disadvantage is that an additional space for installation ofthe opening and closing transfer system having the carrier transferdevice separately from the box transfer device.

The third disadvantage is that it is necessary to provide the openingand closing transfer systems for every manufacturing equipments, forwhich reason the production systems is expensive, resulting in theincreased manufacturing cost. Further, a huge cost is necessary toimprove the production system.

The fourth disadvantage is that a gas is generated from thesemiconductor wafers so that the sealed box is filled with the gas,whereby the gas may provide influences to the characteristic of thesemiconductor wafers due to a long time exposure of the semiconductorwafers to the generated gas.

In the above circumstances, it had been required to develop a novelsemiconductor wafer accommodating jig, handling method and productionsystem free from the above disadvantages.

SUMMARY OF THE INVENTION

Accordingly, it is an object of the present invention to provide a novelsemiconductor wafer accommodating jig free from the above problems.

It is a further object of the present invention to provide a novelsemiconductor wafer accommodating jig capable of concurrent operationsof opening and closing the box cap and of carrying the carrier toshorten the necessary time for carrying the carrier and loading orunloading the carrier.

It is a still further object of the present invention to provide a novelsemiconductor wafer accommodating jig suitable for reducing thenecessary space for installation of the production system.

It is yet a further object of the present invention to provide a novelsemiconductor wafer accommodating jig suitable for reducing themanufacturing cost.

It is a further more object of the present invention to provide a novelsemiconductor wafer accommodating jig suitable for reducing the costnecessary for improving the production system.

It is still more object of the present invention to provide a novelsemiconductor wafer accommodating jig rendering the manufacturingequipment simple in structure.

It is moreover object of the present invention to provide a novelsemiconductor wafer accommodating jig rendering the semiconductor wafersfree from adhesion of dusts provided by human.

It is another object of the present invention to provide a novel handingmethod for handling the novel semiconductor wafer accommodating jig freefrom the above problems.

It is still another object of the present invention to provide a novelhanding method for handling the novel semiconductor wafer accommodatingjig capable of concurrent operations of opening and closing the box capand of carrying the carrier to shorten the necessary time for carryingthe carrier and loading or unloading the carrier.

It is yet another object of the present invention to provide a novelhanding method for handling the novel semiconductor wafer accommodatingjig suitable for reducing the necessary space for installation of theproduction system.

It is further another object of the present invention to provide a novelhanding method for handling the novel semiconductor wafer accommodatingjig suitable for reducing the manufacturing cost.

It is an additional object of the present invention to provide a novelhanding method for handling the novel semiconductor wafer accommodatingjig suitable for reducing the cost necessary for improving theproduction system.

It is a still additional object of the present invention to provide anovel handing method for handling the novel semiconductor waferaccommodating jig rendering the manufacturing equipment simple instructure.

It is yet an additional object of the present invention to provide anovel handing method for handling the novel semiconductor waferaccommodating jig rendering the semiconductor wafers free from adhesionof dusts provided by human.

It is a further additional object of the present invention to provide anovel production system having a novel semiconductor wafer accommodatingjig free from the above problems.

It is also additional object of the present invention to provide a novelproduction system having a novel semiconductor wafer accommodating jigcapable of concurrent operations of opening and closing the box cap andof carrying the carrier to shorten the necessary time for carrying thecarrier and loading or unloading the carrier.

It is also additional object of the present invention to provide a novelproduction system having a novel semiconductor wafer accommodating jigsuitable for reducing the necessary space for installation of theproduction system.

It is also additional object of the present invention to provide a novelproduction system having a novel semiconductor wafer accommodating jigsuitable for reducing the manufacturing cost.

It is also additional object of the present invention to provide a novelproduction system having a novel semiconductor wafer accommodating jigsuitable for reducing the cost necessary for improving the productionsystem.

It is also additional object of the present invention to provide a novelproduction system having a novel semiconductor wafer accommodating jigrendering the manufacturing equipment simple in structure.

It is also additional object of the present invention to provide a novelproduction system having a novel semiconductor wafer accommodating jigrendering the semiconductor wafers free from adhesion of dusts providedby human.

The first present invention provides a jig for accommodating andtransferring a carrier for carrying at least an article, the carriercomprising a first container having a first opening larger than thearticle, and the carrier having at least a first flange structure whichextends from a peripheral portion of the first opening, and the firstflange structure having a first size defined to be a distance betweenopposite edges of the first flange structure in a first direction,wherein the jig comprises a second container having a second openingwith a second size larger than the first size of the first flangestructure of the carrier, and the jig further has at least a secondflange structure in an opposite side to a side provided with the secondopening, and the second flange structure has a third size larger thanthe second size, and the jig also has at least a window structure whichextends at least opposite sides and which is positioned adjacent to thesecond flange structure, so that the window structure is closer to thesecond opening than the second flange structure, wherein the firstopening of the carrier is scaleable with a part of an inner wall of thesecond container as the jig by making the first opening of the carrierinto contact with the part of the inner wall of the second container asthe jig, and wherein the window structure comprises a flexible sheetdeformable by an externally applied force.

The above and other objects, features and advantages of the presentinvention will be apparent from the following descriptions.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments according to the present invention will bedescribed in detail with reference to the accompanying drawings.

FIG. 1A is a view illustrative of a conventional carrier transfer systembefore transferring the carrier for semiconductor wafers from a firsttransfer table to a second transfer table involved in a conventionaltransfer method.

FIG. 1B is a view illustrative of a conventional carrier transfer systemafter having transferred the carrier for semiconductor wafers from thefirst transfer table to the second transfer table involved in theconventional transfer method.

FIG. 2 is a schematic perspective view illustrative of a conventionalproduction line utilizing the above conventional carrier transfer systemof FIGS. 1A and 1B.

FIG. 3 is a schematic perspective view illustrative of a novelsemiconductor wafer accommodating jig and a jig transfer device in afirst embodiment in accordance with the present invention

FIG. 4A is a cross sectional elevation view illustrative of a novelsemiconductor wafer accommodating jig taken along a direction of arrowmark “Y” of FIG. 3 in a first embodiment in accordance with the presentinvention.

FIG. 4B is a cross sectional elevation view illustrative of a novelsemiconductor wafer accommodating jig taken along a direction of arrowmark “X” of FIG. 3 in a first embodiment in accordance with the presentinvention.

FIG. 5 is a schematic perspective view illustrative of a carrier forsemiconductor wafers to be accommodated in a novel semiconductor waferaccommodating jig and to be transferred by a jig transfer device of FIG.3 in a first embodiment in accordance with the present invention.

FIGS. 6A through 6D are cross sectional elevation views illustrative ofan operation of lifting the novel semiconductor wafer accommodating jigaccommodating the carrier for subsequent transferring the semiconductorwafer accommodating jig together with the carrier directed so that thesemiconductor wafers in the carrier are aligned in the lateral directionin the first embodiment in accordance with the present invention.

FIGS. 7A through 7D are cross sectional elevation views illustrative ofan operation of lifting the novel semiconductor wafer accommodating jigaccommodating the carrier for subsequent transferring the semiconductorwafer accommodating jig together with the carrier directed so that thesemiconductor wafers in the carrier are stacked in the verticaldirection in the first embodiment in accordance with the presentinvention.

FIGS. 8A through 8L are cross sectional elevation views illustrative ofsequential operations for transferring the carriers to be accommodatedin the semiconductor wafer accommodating jig from the first transfertable to the second transfer table in the first embodiment in accordancewith the present invention.

FIG. 9 is a schematic perspective view illustrative of a novelproduction line utilizing the above novel carrier transfer system in thefirst embodiment in accordance with the present invention.

FIG. 10 is a schematic perspective view illustrative of a novel modifiedproduction line utilizing the above novel carrier transfer system in themodification to the above first embodiment in accordance with thepresent invention.

DISCLOSURE OF THE INVENTION

The first present invention provides a jig for accommodating andtransferring a carrier for carrying at least an article, the carriercomprising a first container having a first opening larger than thearticle, and the carrier having at least a first flange structure whichextends from a peripheral portion of the first opening, and the firstflange structure having a first size defined to be a distance betweenopposite edges of the first flange structure in a first direction,wherein the jig comprises a second container having a second openingwith a second size larger than the first size of the first flangestructure of the carrier, and the jig further has at least a secondflange structure in an opposite side to a side provided with the secondopening, and the second flange structure has a third size larger thanthe second size, and the jig also has at least a window structure whichextends at least opposite sides and which is positioned adjacent to thesecond flange structure, so that the window structure is closer to thesecond opening than the second flange structure, wherein the firstopening of the carrier is sealable with a part of an inner wall of thesecond container as the jig by making the first opening of the carrierinto contact with the part of the inner wall of the second container asthe jig, and wherein the window structure comprises a flexible sheetdeformable by an externally applied force.

It is preferable that the first container as the carrier has arectangular parallelepiped shape comprising a bottom wall of four sidewalls, and the first flange comprises at least a pair of first flangesextending outwardly from a first pair of opposite sides of peripheralsof the first opening, and that the second container as the jig also hasa rectangular parallelepiped shape comprising a top wall and four sidewalls, and the second flange structure comprises at least a pair ofsecond flanges extending outwardly from a first pair of opposite sidesof the top wall, and the window structure comprises at least a pair ofthe flexible sheets provided in a first pair of opposite side walls ofthe four side walls so that the flexible sheets are positioned directlyunder the second flanges of the jig.

It is preferable that the top wall of the jig has an inner facedownwardly and the inner face has an oblique angle to a flat level, andouter faces of the first flanges have the same oblique angle so that theouter faces of the first flanges of the carrier are parallel to theinner face of the top wall of the jig.

It is preferable that the top wall of the jig has an outer face upwardlyand the outer face is parallel to the flat level, so that the top wallvaries in thickness in a lateral direction.

It is preferable that at least one of second paired opposite side wallsof the four side walls has an inner face with an oblique angle to avertical plane, and outer faces of the first flanges have the sameoblique angle so that the outer faces of the first flanges of thecarrier are parallel to the inner face of the top wall of the jig.

It is preferable that the at least one of second paired opposite sidewalls of the jig has an outer face parallel to the vertical plane, sothat the at least one of second paired opposite side walls varies inthickness in a vertical direction.

The second present invention provides a jig for accommodating andtransferring a carrier for carrying at least an article, wherein the jigcomprises a container having an opening and at least a second flangestructure in an opposite side to a side provided with the opening, andat least a window structure adjacent to the flange structure, so thatthe window structure is closer to the opening than the flange structure,and the window structure comprises a flexible sheet deformable by anexternally applied force.

It is preferable that the container as the jig has a rectangularparallelepiped shape comprising a top wall and four side walls, and theflange structure comprises at least a pair of flanges extendingoutwardly from a first pair of opposite sides of the top wall, and thewindow structure comprises at least a pair of the flexible sheetsprovided in a first pair of opposite side walls of the four side wallsso that the flexible sheets are positioned directly under the flanges ofthe jig.

It is preferable that the top wall of the jig has an inner facedownwardly and the inner face has an oblique angle to a flat level.

It is preferable that the top wall of the jig has an outer face upwardlyand the outer face is parallel to the flat level, so that the top wallvaries in thickness in a lateral direction.

It is preferable that at least one of second paired opposite side wallsof the four side walls has an inner face with an oblique angle to avertical plane.

It is preferable that the at least one of second paired opposite sidewalls of the jig has an outer face parallel to the vertical plane, sothat the at least one of second paired opposite side walls varies inthickness in a vertical direction.

The third present invention provides a transfer system comprising: atransfer device having at least a pair of claws adjustable in a distancebetween inside edges of the claws; a carrier for carrying at least anarticle, the carrier comprising a first container having a first openinglarger than the article, and the carrier having at least a first flangestructure which extends from a peripheral portion of the first opening,and the first flange structure having a first size defined to be adistance between opposite edges of the first flange structure in a firstdirection; and a jig comprising a second container having a secondopening with a second size larger than the first size of the firstflange structure of the carrier, and the jig further having at least asecond flange structure in an opposite side to a side provided with thesecond opening, and the second flange structure having a third sizelarger than the second size, and the jig also having at least a windowstructure which extends at least opposite sides and which is positionedadjacent to the second flange structure, so that the window structure iscloser to the second opening than the second flange structure, whereinthe first opening of the carrier is sealable with a part of an innerwall of the second container as the jig by making the first opening ofthe carrier into contact with the part of the inner wall of the secondcontainer as the jig, and wherein the window structure comprisesflexible sheets deformable by pushing the claws to the flexible sheets.

It is preferable that the first container as the carrier has arectangular parallelepiped shape comprising a bottom wall of four sidewalls, and the first flange comprises at 1cast a pair of first flangesextending outwardly from a first pair of opposite sides of peripheralsof the first opening, and wherein the second container as the jig alsohas a rectangular parallelepiped shape comprising a top wall and fourside walls, and the second flange structure comprises at least a pair ofsecond flanges extending outwardly from a first pair of opposite sidesof the top wall, and the window structure comprises at least a pair ofthe flexible sheets provided in a first pair of opposite side walls ofthe four side walls so that the flexible sheets arc positioned directlyunder the second flanges of the jig.

It is preferable that the top wall of the jig has an inner facedownwardly and the inner face has an oblique angle to a flat level, andouter faces of the first flanges have the same oblique angle so that theouter faces of the first flanges of the carrier are parallel to theinner face of the top wall of the jig.

It is preferable that the top wall of the jig has an outer face upwardlyand the outlet face is parallel to the flat level, so that the top wallvaries in thickness in a lateral direction.

It is preferable that at least one of second paired opposite side wallsof the four side walls has an inner face with an oblique angle to avertical plane, and outer faces of the first flanges have the sameoblique angle so that the outer faces of the first flanges of thecarrier are parallel to the inner face of the top wall of the jig.

It is preferable that the at least one of second paired opposite sidewalls of the jig has an outer face parallel to the vertical plane, sothat the at least one of second paired opposite side walls varies inthickness in a vertical direction

The fourth present invention provides a semiconductor wafer productionsystem including a transfer system comprising: a transfer device havingat least a pair of claws adjustable in a distance between inside edgesof the claws; a carrier for carrying at least an article, the carriercomprising a first container having a first opening larger than thearticle, and the carrier having at least a first flange structure whichextends from a peripheral portion of the first opening, and the firstflange structure having a first size defined to be a distance betweenopposite edges of the first flange structure in a first direction; and ajig comprising a second container having a second opening with a secondsize larger than the first size of the fist flange structure of thecarrier, and the jig further having at least a second flange structurein an opposite side to a side provided with the second opening, and thesecond flange structure having a third size larger than the second size,and the jig also having at least a window structure which extends atleast opposite sides and which is positioned adjacent to the secondflange structure, so that the window structure is closer to the secondopening than the second flange structure, wherein the first opening ofthe carrier is sealable with a part of an inner wall of the secondcontainer as the jig by making the first opening of the carrier intocontact with the part of the inner wall of the second container as thejig, and wherein the window structure comprises flexible sheetsdeformable by pushing the claws to the flexible sheets.

It is preferable that the first container as the carrier has arectangular parallelepiped shape comprising a bottom wall of four sidewalls, and the first flange comprises at least a pair of first flangesextending outwardly from a first pair of opposite sides of peripheralsof the first opening, and that the second container as the jig also hasa rectangular parallelepiped shape comprising a top wall and four sidewalls, and the second flange structure comprises at least a pair ofsecond flanges extending outwardly from a first pair of opposite sidesof the top wall, and the window structure comprises at least a pair ofthe flexible sheets provided in a first pair of opposite side walls ofthe four side walls so that the flexible sheets are positioned directlyunder the second flanges of the jig.

It is preferable that the top wall of the jig has an inner facedownwardly and the inner face has an oblique angle to a flat level, andouter faces of the first flanges have the same oblique angle so that theouter faces of the first flanges of the carrier are parallel to theinner face of the top wall of the jig.

It is preferable that the top wall of the jig has an outer face upwardlyand the outer face is parallel to the flat level, so that the top wallvaries in thickness in a lateral direction.

It is preferable that at least one of second paired opposite side wallsof the four side walls has an inner face with an oblique angle to avertical plane, and outer faces of the first flanges have the sameoblique angle so that the outer faces of the first flanges of thecarrier are parallel to the inner face of the top wall of the jig.

It is preferable that the at least one of second paired opposite sidewalls of the jig has an outer face parallel to the vertical plane, sothat the at least one of second paired opposite side walls varies inthickness in a vertical direction.

PREFERRED EMBODIMENTS

First Embodiment

A first embodiment according to the present invention will be describedin detail with reference to FIGS. 3, 4A and 4B and 5. FIG. 3 is aschematic perspective view illustrative of a novel semiconductor waferaccommodating jig and a jig transfer device in a first embodiment inaccordance with the present invention. FIG. 4A is a cross sectionalelevation view illustrative of a novel semiconductor wafer accommodatingjig taken along a direction of arrow mark “Y” of FIG. 3 in a firstembodiment in accordance with the present invention. FIG. 4B is a crosssectional elevation view illustrative of a novel semiconductor waferaccommodating jig taken along a direction of arrow mark “X” of FIG. 3 ina first embodiment in accordance with the present invention. FIG. 5 is aschematic perspective view illustrative of a carrier for semiconductorwafers to be accommodated in a novel semiconductor wafer accommodatingjig and to be transferred by a jig transfer device of FIG. 3 in a firstembodiment in accordance with the present invention.

With reference to FIG. 3, a novel semiconductor wafer accommodating jig1 in accordance with the present invention is placed on a flat topsurface of a first transfer table 4. The semiconductor waferaccommodating jig 1 comprises a bottom-free cubic-shaped cover 6 whichforms a bottom-free cubic box. The bottom free cubic-shaped cover 6 hasa top face, a first pair of opposite side faces distanced from eachother in an X-axis direction and a second pair of opposite side facesdistanced from each other in a Y-axis direction. Each of the secondpaired opposite side faces of the bottom free cubic-shaped cover 6 has awindow 8 made of a flexible material and a flange 7 extending outwardlyand over the window 8. A transfer device 3 comprises a control section12 and a pair of L-shaped claws 13 for hooking the flanges 7 of thesemiconductor wafer accommodating jig 1. A carrier 2 for a plurality ofsemiconductor wafers 10 is covered by the bottom free cubic-shaped cover6. The transfer device 3 is movable between first and second transfertables 4 and 5. The normal direction to the flat top surface of thefirst and second transfer tables 4 and 5 is Z-axis.

With reference to FIG. 4A, the carrier 2 for carrying a plurality of thesemiconductor wafers 10 is accommodated within or covered by thebottom-free cubic-shaped cover 6 as the semiconductor waferaccommodating jig 1. The semiconductor wafer accommodating jig 1 has thesecond paired opposite side walls which have the windows 8 made offlexible materials and the flanges 7. The bottom-free cubic-shaped cover6 has an opening bottom 16. Namely, the bottom free cubic-shaped cover 6has the top wall, the first pair of the opposite side walls distancedform each other in the X-axis direction and the second pair of oppositeside walls distanced form each other in the Y-axis direction as well asthe opening bottom 16. The semiconductor wafer accommodating jig 1 orthe bottom-free cubic-shaped cover 6 and the flanges 7 are made of amaterial which generates no dust, for example, polypropylene. Each ofthe windows 8 comprises an opening which is covered with a flexiblesheet which is adhered with an adhesive to the peripheral portions ofthe opening, wherein the flexible sheet is made of a material whichgenerates no dust, for example, silicone rubber, so as to allow theclaws 13 of the transfer device 3 to push the flexible sheets into theopenings so that the inside edges of the claws 13 also enter into theopenings.

Meanwhile, the carrier 2 comprises a top-free cubic-shaped box whichcomprises an opening top 18, a bottom 20 and four side walls 19. Thesemiconductor wafers 10 are entered through the opening top 18 into thecarrier 2 and are picked out through the opening top 18 from the carrier2. The semiconductor wafer accommodating jig 1 has a first dimension 1Ddefined to be a distance between opposite edges of the flanges 7. Thesemiconductor wafer accommodating jig 1 also has a second dimension 1Edefined to be a distance between opposite inner walls of thesemiconductor wafer accommodating jig 1. The carrier 2 has a thirddimension 2B defined to be a distance between opposite outer walls ofthe carrier 2. It is an example that the first dimension 1D is 250millimeters, the second dimension 1E is 210 millimeters and the thirddimension 2B is 200 millimeters. The control section 12 of the transferdevice 3 controls a distance between the inside edges of the L-shapedclaws 13. If the distance between the inside edges of the L-shaped claws13 is larger than the first dimension 1D, then the L-shaped claws 13 arein the opening state for releasing the semiconductor wafer accommodatingjig 1. If the distance between the inside edges of the L-shaped claws 13is smaller than the first dimension 1D and larger than the seconddimension 1E, then the L-shaped claws 13 are hooking the flanges 7 ofthe semiconductor wafer accommodating jig 1. If the distance between theinside edges of the L-shaped claws 13 is smaller than the seconddimension 1E and larger than the third dimension 2B, then the L-shapedclaws 13 are booking the carrier 2 accommodated in the semiconductorwafer accommodating jig 1, wherein the inside edges of the L-shapedclaws 13 push the flexible sheets of the windows 8 into the openings sothat the inside edges of the L-shaped claws 13 enter into the openings.The semiconductor wafer accommodating jig 1 also has a fourth dimension1A defined between an inside face of the top wall of the bottom-freecubic-shaped cover 6 and bottom faces of the flanges 7. Thesemiconductor wafer accommodating jig 1 also has a fifth dimension 2Adefined to be a thickness of flanges 17A of the carrier 2. The L-shapedclaws 13 have a sixth dimension 3A defined by a thickness of theinwardly and laterally extending hook portions of the L-shaped claws 13as well as a seventh dimension 3B defined by a length of the inwardlyand laterally extending hook portion. An eighth dimension 1C is definedbetween an outside edge of the flange 7 of the bottom-free cubic-shapedcover 6 of the of the semiconductor wafer accommodating jig 1 and anoutside face of the side wall of the carrier 2. A ninth dimension 1B isdefined between the bottom of the carrier flange 17A of the carrier 2and a bottom of the window 8 of the bottom-free cubic-shaped cover 6 ofthe semiconductor wafer accommodating jig 1. It is important that thefourth dimension 1A defined between the inside face of the top wall ofthe bottom-free cubic-shaped cover 6 and the bottom faces of the flanges7 is smaller than the fifth dimension 2A defined to be the thickness offlanges 17A of the carrier 2, even if the top of the carrier 2 is madeinto contact with the inner face of the top wall of the bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1,then the bottom of the carrier flanges 17A lies the lower level than thebottom of the flanges of the bottom-free cubic-shaped cover 6 of thesemiconductor wafer accommodating jig 1. It is also important that theseventh dimension 3B defined by the length of the inwardly and laterallyextending hook portion of the L-shaped claw 13 is larger than the eighthdimension 1C defined between the outside edge of the flange 7 of thebottom-free cubic-shaped cover 6 of the of the semiconductor waferaccommodating jig 1 and the outside face of the side wall of the carrier2, so that if the L-shaped claws 13 are closed, then the inside edges ofthe inwardly and laterally extending hook portions of the L-shaped claws13 reach the bottoms of the carrier flanges 17A and also the outsidefaces of the side walls of the carrier 2. It is also important that theninth dimension 1B defined between the bottom of the carrier flange 17Aof the carrier 2 and the bottom of the window 8 of the bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1 islarger than the sixth dimension 3A defined by the thickness of theinwardly and laterally extending hook portions of the L-shaped claws 13,so that if the L-shaped claws 13 are closed, then the inside edges ofthe inwardly and laterally extending hook portions of the L-shaped claws13 are allowed to move into positions under the bottoms of the carrierflanges 17A. It is an example that the fourth dimension 1A is 20millimeters, the fifth dimension 2A is 25 millimeters, the ninthdimension 1B is 12 millimeters, the eighth dimension 1C is 40millimeters, the sixth dimension 3A is 10 millimeters, and the seventhdimension 3D is 50 millimeters as well as the bottoms of the windows 8lie a level of 163 millimeters from the top flat surface of the fit orsecond transfer table 4 or 5.

With reference to FIG. 4B, when the semiconductor wafer accommodatingjig 1 is placed on the flat surface of the first or second transfertable 4 or 5, one of the first paged opposite side walls of thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 has an oblique inner face 14 and a vertical outerface so that a thickness of the one of the first paired opposite sidewalls proportionally decreases toward the downwardly. Namely, thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 has a thickness-varied side wall having the obliqueinner face 14 which is oblique to the vertical outer face by an obliqueangle θ. The bottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 has the top wall which is defined by a flat outerface and an oblique inner face 15 so that a thickness of the top walldecreases toward the thickness-varied side wall. Namely, the bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1 hasa thickness-varied top wall having the oblique inner face 15 which isoblique to the flat outer face by an oblique angle θ. The bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1 hasa first size 1F which is defined o be a length thereof along the X-axisdirection. Each of the windows 8 is a rectangular-shaped to have a sizeof 25 mm×180 mm.

With reference to FIG. 5, the carrier 2 has a first carrier flange 17Aextending outwardly from a peripheral portion of the top of the fourside walls so that a square-shaped inside edge of the first carrierflange 17A defines a square-shaped carrier top opening 18. The firstcarrier flange 17A has an oblique outer and upper face which is obliqueto the flat face by the oblique angle θ and a flat bottom face so that athickness of the first carrier flange 17A proportionally increases. Thecarrier 2 has a second carrier flange 17B extending outwardly from aperipheral portion of the side wall toward which the thickness of thefirst carrier flange 17A proportionally decreases. The first carrierflange 17A of the carrier 2 is to be hooked by the claws 13 fortransferring the carrier 2 directed so that the semiconductor wafers arealigned in the lateral direction. The second carrier flange 17B of thecarrier 2 is to be hooked by the claws 13 for transferring the carrier 2directed so that the semiconductor wafers are stacked in the verticaldirection.

FIGS. 6A through 6D are cross sectional elevation views illustrative ofan operation of lifting the novel semiconductor wafer accommodating jigaccommodating the carrier for subsequent transferring the semiconductorwafer accommodating jig together with the carrier directed so that thesemiconductor wafers in the carrier are aligned in the lateral directionin the first embodiment in accordance with the present invention.

With reference to FIG. 6A, the carrier 2 is accommodated in thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 so that the carrier 2 is directed so that thesemiconductor wafers in the carrier are aligned in the lateraldirection, wherein the first flange 17A of the carrier is positionedtop, and the thickness of the first carrier flange 17A proportionallyincreases toward the oblique inner face 14 of the thickness-varied sidewall of the bottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1. The oblique outer and upper face 18 of thethickness-varied first flange 17 of the carrier 2 faces to the obliqueinner and bottom face 15 of the thickness-varied top wall of thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1, wherein the thickness of the top wall of thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 decreases toward the oblique inner face 14 of thethickness-varied side wall of the bottom-free cubic-shaped cover 6 ofthe semiconductor wafer accommodating jig 1, whereby the oblique outerand upper face 18 of the thickness-varied first flange 17 of the carrier2 is parallel to the oblique inner and bottom face 15 of thethickness-varied top wall of the bottom-free cubic-shaped cover 6 of thesemiconductor wafer accommodating jig 1. The carrier 2 and thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 are placed on the flat surface of the fist or secondtransfer table 4 or 5 so that the carrier 2 has no contact with thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1.

With reference to FIG. 6B, the L-shaped claws 13 are closed so that thedistance between the inside edges of the L-shaped claws 13 comes smallerthan the second dimension 1E and larger than the third dimension 2B,wherein the inside edges of the L-shaped claws 13 push the flexiblesheets of the windows 8 into the openings and the inside edges of theL-shaped claws 13 enter into the openings, whereby the inside edges ofthe inwardly and laterally extending hook portions of the L-shaped claws13 reach the bottoms of the carrier flanges 17A and also reach theoutside faces of the side walls of the carrier 2, resulting in that theL-shaped claws 13 arc hooking the first flange 17A of the carrier 2accommodated in the semiconductor wafer accommodating jig 1. Thetransfer device 3 is moved upwardly so that the L-shaped claws 13hooking the first flange 17A of the carrier 2 lift up the carrier 2.

With reference to FIG. 6C, the carrier 2 is lift up so that the obliqueouter and upper face 18 of the thickness-varied first flange 17 of thecarrier 2 is made into contact with the oblique inner and bottom face 15of the thickness-varied top wall of the bottom-free cubic-shaped cover 6of the semiconductor wafer accommodating jig 1, whereby thesemiconductor wafers in the carrier 2 is sealed with the bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1.

With reference to FIG. 6D, the carrier 2 is further lift up so that thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 is also lift up along with the carrier 2 withkeeping the state that the semiconductor wafers 10 in the carrier 2 aresealed with the bottom-free cubic-shaped cover 6 of the semiconductorwafer accommodating jig 1. During the transfer of the carrier 2 betweenthe first and second transfer tables 4 and 5, the opening side of thecarrier 2 is made into contact securely with the oblique inner face 14of the thickness-varied side wall of the bottom-free cubic-shaped cover6 of the semiconductor wafer accommodating jig 1, whereby thesemiconductor wafers 10 in the carrier 2 are isolated from theatmosphere.

FIGS. 7A through 7D are cross sectional elevation views illustrative ofan operation of lifting the novel semiconductor wafer accommodating jigaccommodating the carrier for subsequent transferring the semiconductorwafer accommodating jig together with the carrier directed so that thesemiconductor wafers in the carrier arc stacked in the verticaldirection in the first embodiment in accordance with the presentinvention.

With reference to FIG. 7A, the carrier 2 is accommodated in thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 so that the carrier 2 is directed so that thesemiconductor wafers in the carrier 2 are stacked is the verticaldirection, wherein the second flange 17B of the carrier 2 is positionedtop, and the thickness of the first carrier flange 17A proportionallyincreases downwardly and the oblique outer face 18 of the first carrierflange 17A faces to the oblique inner face 14 of the thickness-variedside wall of the bottom-free cubic-shaped cover 6 of the semiconductorwafer accommodating jig 1. The thickness-uniform second flange 17B ofthe carrier 2 faces to the oblique inner and bottom face 15 of thethickness-varied top wall of the bottom-free cubic-shaped cover 6 of thesemiconductor wafer accommodating jig 1, wherein the thickness of thetop wall of the bottom-free cubic-shaped cover 6 of the semiconductorwafer accommodating jig 1 decreases toward the oblique inner face 14 ofthe thickness-varied side wall of the bottom-free cubic-shaped cover 6of the semiconductor wafer accommodating jig 1, whereby the obliqueouter face 18 of the thickness-varied first flange 17 of the carrier 2is parallel to the oblique inner face 14 of the thickness-varied sidewall of the bottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1. The carrier 2 and the bottom-free cubic-shapedcover 6 of the semiconductor wafer accommodating jig 1 are placed on theflat surface of the first or second transfer table 4 or 5 so that thecarrier 2 has no contact with the bottom-free cubic-shaped cover 6 ofthe semiconductor wafer accommodating jig 1.

With reference to FIG. 7B, the L-shaped claws 13 are closed so that thedistance between the inside edges of the L-shaped claws 13 comes smallerthan the second dimension 1E and larger than the third dimension 2B,wherein the inside edges of the L-shaped claws 13 push the flexiblesheets of the windows 8 into the openings and the inside edges of theL-shaped claws 13 enter into the openings, whereby the inside edges ofthe inwardly and laterally extending hook portions of the L-shaped claws13 reach the bottoms of the second carrier flange 17B, resulting in thatthe L-shaped claws 13 are hooking the second flange 17B of the carrier 2accommodated in the semiconductor wafer accommodating jig 1. Thetransfer device 3 is moved upwardly so that the L-shaped claws 13hooking the second flange 17B of the carrier 2 lift up the carrier 2.

With reference to FIG. 7C, the carrier 2 is further lift up so that theoblique outer and upper face 18 of the thickness-varied first flange 17of the carrier 2 is made into contact with the oblique inner face 14 ofthe thickness-varied side wall of the bottom-free cubic-shaped cover 6of the semiconductor wafer accommodating jig 1, whereby thesemiconductor wafers in the carrier 2 are sealed with the bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1.With reference to FIG. 7D, the carrier 2 is further lift up so that thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 is also lift up along with the carrier 2 withkeeping the state that the semiconductor wafers in the carrier 2 issealed with the bottom-free cubic-shaped cover 6 of the semiconductorwafer accommodating jig 1. During the transfer of the carrier 2 betweenthe first and second transfer tables 4 and 5, the opening side of thecarrier 2 is made into contact securely with the oblique inner face 14of the thickness-varied side wall of the bottom-free cubic-shaped cover6 of the semiconductor wafer accommodating jig 1, whereby thesemiconductor wafers 10 in the carrier 2 are isolated from theatmosphere.

FIGS. 8A through 8L are cross sectional elevation views illustrative ofsequential orations for transferring the carriers to be accommodated inthe semiconductor wafer accommodating jig from the first transfer tableto the second transfer table in the first embodiment in accordance withthe present invention.

With reference to FIG. 8A, the carrier 2 is accommodated in thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 so that the carrier 2 is directed so that thesemiconductor wafers in the carrier are aligned in the lateraldirection, wherein the first flange 17A of the carrier is positionedtop, and the thickness of the first carrier flange 17A proportionallyincreases toward the oblique inner face 14 of the thickness-varied sidewall of the bottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1. The oblique outer and upper face 18 of thethickness-varied first flange 17 of the carrier 2 faces to the obliqueinner and bottom face 15 of the thickness-varied top wall of thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1, wherein the thickness of the top wall of thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 decreases toward the oblique inner face 14 of thethickness-varied side wall of the bottom-free cubic-shaped cover 6 ofthe semiconductor wafer accommodating jig 1, whereby the oblique outerand upper face 18 of the thickness-varied first flange 17 of the carrier2 is parallel to the oblique inner and bottom face 15 of thethickness-varied top wall of the bottom-free cubic-shaped cover 6 of thesemiconductor wafer accommodating jig 1. The carrier 2 and thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 are placed on the flat surface of the first orsecond transfer table 4 or 5 so that the carrier 2 has no contact withthe bottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1.

With reference to FIG. 8B, the L-shaped claws 13 are closed so that thedistance between the inside edges of the L-shaped claws 13 comes smallerthan the second dimension 1E and larger than the third dimension 2B,wherein the inside edges of the L-shaped claws 13 push the flexiblesheets of the windows 8 into the openings and the inside edges of theL-shaped claws 13 enter into the openings, whereby the inside edges ofthe inwardly and laterally extending hook portions of the L-shaped claws13 reach the bottoms of the carrier flanges 17A and also reach theoutside faces of the side walls of the carrier 2, resulting in that theL-shaped claws 13 are hooking the first flange 17A of the carrier 2accommodated in the semiconductor wafer accommodating jig 1. Thetransfer device 3 is moved upwardly so that the L-shaped claws 13hooking the first flange 17A of the carrier 2 lift up the carrier 2.

With reference to FIG. 8C, the carrier 2 is lift up so that the obliqueouter and upper face 18 of the thickness-varied first flange 17 of thecarrier 2 is made into contact with the oblique inner and bottom face 15of the thickness-varied top wall of the bottom-free cubic-shaped cover 6of the semiconductor wafer accommodating jig 1, whereby thesemiconductor wafers in the carrier 2 is sealed with the bottom-freecubic-shaped cover 6 of the semiconductor wafer accommodating jig 1.

With reference to FIG. 8D, the carrier 2 is further lift up so that thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1 is also lift up along with the carrier 2 withkeeping the state that the semiconductor wafers 10 in the carrier 2 aresealed with the bottom-free cubic-shaped cover 6 of the semiconductorwafer accommodating jig 1. During the transfer of the carrier 2 betweenthe first and second transfer tables 4 and 5, the opening side of thecarrier 2 is made into contact securely with the oblique inner face 14of the thickness-varied side wall of the bottom-free cubic-shaped cover6 of the semiconductor wafer accommodating jig 1, whereby thesemiconductor wafers 10 in the carrier 2 are isolated from theatmosphere.

With reference to FIGS. 8D and 8E, the transfer device 3 is moved from aposition over the first transfer table 4 to a position over the secondtransfer table 5, so as to transfer the semiconductor waferaccommodating jig 1 accommodating the carrier 2 from the position overthe first transfer table 4 to the position over the second transfertable 5 with keeping the sealing state that the oblique outer and upperface 18 of the thickness-varied first flange 17 of the carrier 2 remainscontact with the oblique inner and bottom face 15 of thethickness-varied top wall of the bottom-free cubic-shaped cover 6 of thesemiconductor wafer accommodating jig 1, whereby the semiconductorwafers in the carrier 2 remains sealed with the bottom-free cubic-shapedcover 6 of the semiconductor wafer accommodating jig 1.

With reference to FIG. 8F, the transfer device 3 is moved downwardly sothat the semiconductor wafer accommodating jig 1 accommodating thecarrier 2 with the first carrier flange 17A hooked by the claws 13 ofthe transfer device 3 falls down onto a flat surface of the secondtransfer table 5, whereby the semiconductor wafer accommodating jig 1and the carrier 2 are placed on the flat surface of the second transfertable 5, resulting in that the oblique outer and upper face 18 of thethickness-varied first flange 17 of the carrier 2 is detached from theoblique inner and bottom face 15 of the thickness-varied top wall of thebottom-free cubic-shaped cover 6 of the semiconductor waferaccommodating jig 1.

With reference to FIG. 8G, the claws 13 of the transfer device 3 areopened so that the distance between the inside edges of the L-shapedclaws 13 is smaller than the first dimension 1D defined to be a distancebetween opposite edges of the jig flange 7 and larger than the seconddimension 1E defined to be a distance between opposite inner walls ofthe semiconductor wafer accommodating jig 1.

With reference to FIG. 8H, the transfer device 3 is moved upwardly sothat then the L-shaped claws 13 are hooking the flange 7 of thesemiconductor wafer accommodating jig 1 and then the transfer device 3is further moved upwardly so as to lift up only the semiconductor waferaccommodating jig 1 from the flat surface of the second transfer table5, whilst the carrier 2 remains on the flat surface of the secondtransfer table 5.

With reference to FIG. 8J, the transfer device 3 is moved from theposition over the second transfer table 5 to the position over the firsttransfer table 4 so as to transfer only the semiconductor waferaccommodating jig 1 from the position over the second transfer table 5to the position over the first transfer table 4.

With reference to FIG. 8K, the transfer device 3 is moved downwardly sothat the semiconductor wafer accommodating jig 1 is fallen down onto theflat surface of the second transfer table 5, whereby the semiconductorwafer accommodating jig 1 is placed on the flat surface of the secondtransfer table 5.

With reference to FIG. 8K, the claws 13 of the transfer device 3 arefurther opened so that the distance between the inside edges of theL-shaped claws 13 is larger than the first dimension 1D defined to be adistance between opposite edges of the jig flange 7, thereby releasingthe semiconductor wafer accommodating jig 1 from the transfer device 3.

With reference to FIG. 8L the transfer device 3 with the claws 13 ismoved upwardly whilst the semiconductor wafer accommodating jig 1remains on the flat surface of the first transfer table 4.

The above descriptions have been directed to the unloading operation.Notwithstanding, the loading operation is the reverse processes of FIGS.8L through 8A to the above unloading operation.

FIG. 9 is a schematic perspective view illustrative of a novelproduction line utilizing the above novel carrier transfer system in thefirst embodiment in accordance with the present invention. The novelproduction line has a plurality of manufacturing equipments 21, aplurality of automatic carrier trucks 23, and an automatic rack 22 Eachof the automatic carrier trucks 23 has a loading surface 26 for carryingthe semiconductor wafer accommodating jig 1 accommodating the carrier 2for carrying a plurality of the semiconductor wafers 10. Each of themanufacturing equipments 21 has an entrance 24 without any additionaltransfer system. The automatic rack 22 also has an entrance 25 withoutany additional transfer system. Each of the automatic carrier trucks 23has the transfer device 3. The operation of transferring the carrierfrom the automatic rack 22 to the manufacturing equipment 21 isaccomplished as follows. The carrier 2 with the semiconductor wafers 10appears on the entrance 25 of the automatic rack 22. Any of theautomatic carrier trucks 23 is allocated and then moved to the entrance25 of the automatic rack 22. The transfer device 3 provided on theautomatic carrier truck 23 is operated to move the semiconductor waferaccommodating jig 1 from the loading surface 26 to the entrance 25 ofthe automatic rack 22 so that there are carried out the loadingoperations which are the reverse processes to the unloading operationsdescribed above with reference to FIGS. 8A through 8L, whereby thecarrier 2 is accommodated within the semiconductor wafer accommodatingjig 1 and transferred from the entrance 25 of the automatic rack 22 ontothe loading surface 26 of the automatic carrier truck 23. The automaticcarrier truck 23 carries to selected one of the manufacturing equipments21, so that the transfer device 3 provided on the automatic carriertruck 23 is operated to move the semiconductor wafer accommodating jig 1with the carrier 2 from the loading surface 26 to the entrance 25 of themanufacturing equipments 21.

FIG. 10 is a schematic perspective view illustrative of a novel modifiedproduction line utilizing the above novel carrier transfer system in themodification to the above first embodiment in accordance with thepresent invention. The novel production line has a plurality of vehicles33 with loading surfaces 36, which are automatically travel on a rail37, and first and second automatic racks 31 and 32. The first automaticrack 31 has a first entrance 34 and a first transfer device 3. Thesecond automatic rack 32 has a second entrance 35 and a second transferdevice 3. The operation of transferring the carrier from the firstautomatic rack 31 to the second automatic rack 32 is accomplished asfollows. The carrier 2 with the semiconductor wafers 10 appears on theentrance 35 of the second automatic rack 32. Any of the vehicle 33 isallocated and then moved to the entrance 35 of the second automatic rack32. The second transfer device 3 provided on the second automatic rack32 is operated to move the semiconductor wafer accommodating jig 1 fromthe loading surface 36 to the entrance 35 of the second automatic rack32 so that there are carried out the loading operations which are thereverse processes to the unloading operations described above withreference to FIGS. 8A through 8L, whereby the carrier 2 is accommodatedwithin the semiconductor wafer accommodating jig 1 and transferred fromthe entrance 35 of the second automatic rack 32 onto the loading surface36 of the vehicle 33. The vehicle 33 carries the semiconductor waferaccommodating jig 1 with the carrier 2 to the entrance 34 of the firstautomatic rack 31, so that the first transfer device 3 provided on thefirst automatic rack 31 is operated to move the semiconductor waferaccommodating jig 1 with the carrier 2 from the loading surface 36 tothe entrance 34 of the first automatic rack 31.

The above novel carrier transfer system has the following fouradvantages. The first advantage of the novel carrier transfer system isthat it takes a short time to carry the carrier and loading or unloadingthe carrier because it is possible concurrent operations of opening andclosing the carrier cover and of transferring the carrier.

The second advantage is that no additional space is necessary becausethere need no installation of the opening and closing transfer systemhaving the carrier transfer device separately from the box transferdevice.

The third disadvantage is that it is unnecessary to provide the openingand closing transfer systems for every manufacturing equipments, forwhich reason the production systems is not expensive, resulting in thereduced manufacturing cost. Further, a reduced cost is necessary toimprove the production system.

The fourth advantage is that even if a gas is generated from thesemiconductor wafers so that the sealed box is filled with the gas, thenthe gas may provide no influences to the characteristic of thesemiconductor wafers due to a short time exposure of the semiconductorwafers to the generated gas.

Whereas modifications of the present invention will be apparent to aperson having ordinary skill in the art, to which the inventionpertains, it is to be understood that embodiments as shown and describedby way of illustrations are by no means intended to be considered in alimiting sense. Accordingly, it is to be intended to cover by claims allmodifications which fall within the spirit and scope of the presentinvention.

What is claimed is:
 1. A jig for accommodating and transferring acarrier for carrying at least an article, said jig comprising: acontainer having an opening and at least a flange structure in a sideopposite to a side provided with said opening, and at least a windowstructure adjacent to said flange structure, wherein said windowstructure is positioned between said opening and said flange structure,and said window structure comprises a flexible sheet deformable by anexternally applied force.
 2. The jig as claimed in claim 1, wherein:said container has a rectangular parallelepiped shape comprising a topwall and four side walls, said flange structure comprises at least apair of flange extending outwardly from a pair of opposite sides of saidtop wall, and said window structure comprises at least a pair of saidflexible sheets provided in a first pair of opposite side walls of saidfour side walls, said flexible sheets being positioned directly undersaid flanges.
 3. The jig as claimed in claim 2, wherein said top wallcomprises an inner face downwardly positioned and said inner face has anoblique angle relative to a flat level.
 4. The jig as claimed in claim3, wherein said top wall comprises an outer face upwardly positioned andsaid outer face is parallel relative to said flat level, wherein saidtop wall varies in thickness in a lateral direction.
 5. The jig asclaimed in claim 2, wherein at least one of a second pair of oppositeside walls of said four side walls has an inner face with an obliqueangle relative to a vertical plane.
 6. The jig as claimed in claim 5,wherein said at least one of the second pair of opposite side walls hasan outer face parallel to said vertical plane, wherein said at least oneof the second pair of opposite side walls varies in thickness in avertical direction.